
LT3599
PACKAGE DESCRIPTION
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation EB
4.75
(.1 8 7)
9.60 – 9. 80*
(.37 8 – .3 8 6)
4.75
(.1 8 7)
2 8 2726 25 24 23 22 21 20 19 1 8 17 16 15
6.60 ± 0.10
4.50 ± 0.10
2.74
(.10 8 )
EXPOSED
PAD HEAT SINK
SEE NOTE 4
0.45 ± 0.05
ON BOTTOM OF
PACKAGE
2.74
(.10 8 )
6.40
(.252)
BSC
1.05 ± 0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
1 2 3 4 5 6 7 8 9 10 11 12 13 14
1.20
4.30 – 4.50*
(.169 – .177)
0.25
REF
0 ° – 8 °
(.047)
MAX
0.65
0.09 – 0.20
0.50 – 0.75
(.0256)
0.05 – 0.15
(.0035 – .0079)
(.020 – .030)
BSC
0.195 – 0.30
(.0077 – .011 8 )
(.002 – .006)
FE2 8 (EB) TSSOP 0204
TYP
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
3599fe
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